姜立军

访问学者

E-mail

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Visiting Time

2013-06-10 —— 2014-06-09

Research Interests

Electromagnetics,Computational Electromagnetics, IC Signal and Power Integrity, EMC/EMI, Antennas, Multidisciplinary EDA Solutions, RF and Microwave Technologies.


Biography

Dr. Lijun Jiang received the Bachelor Degree in electrical engineering from the Beijing University of Aeronautics and Astronautics in 1993, the Master Degree from the Tsinghua University in 1996, and the Ph.D from the University of Illinois at Urbana-Champaign (UIUC) in 2004. From 1996 to 1999, he was an Application Engineer with the Hewlett-Packard Company (HP). From 2004 to 2009, he has been the Postdoc, the Research Staff Member, and the Senior Engineer at IBM T.J. Watson Research Center. Since Dec. 2009, he has been the associate professor at the Department of Electrical and Electronic Engineering, the University of Hong Kong.

At Tsinghua University, he worked on broadband slot-coupled patch antenna analysis and design. One of his works for GPS systems has received the best paper award from the 1st Chinese GPS Technology Symposium. At HP, he provided technical support on RF and microwave measurement technologies, delivered HP EEsof EDA solutions, and worked on customized system integrations. In 1998 he received the HP STAR Award. At UIUC he conducted extensive theoretical researches on fast multipole algorithms (FMA), broadband integral equations, and parasitic parameter extraction methodologies. In 2003 he received the IEEE MTT Graduate Fellowship Award. In 2004 he received the UIUC Y.T. Lo Outstanding Research Award. At IBM he worked on computational electromagnetics methodologies for parasitic parameter extraction, on-chip back-end-of-the-line (BEOL) modeling, and multiphysics (thermal-electrical coupling) EDA solutions for IC interconnects, packaging, and 3D integration (3DI). He received the IBM First Patent Application Invention Achievement Award in 2007 and the IBM Research Accomplishment Award in 2008.

As to teaching, he has mentored or co-mentored 5 summer intern graduate students from several US universities over three research initiatives at IBM Research. Two US patents and one IBM Research achievement award have been generated directly from these supervision activities. At HP he acted as a professional teacher. He tailored a wide range of engineering courses for RF/microwave measurements and EDA technologies. The longest course he taught lasted 5 full days in a row. Hundreds of industrial engineers and academic students have listened his course lectures, open seminars, and special topic trainings. He also advised invited professors to give better lectures for HP.

He is an IEEE Senior Member, the Editor of Progress in Electromagnetics Research, Associate Guest Editor of the Proceedings of IEEE Special Issue in 2011~2012, an IEEE AP-S Member, an IEEE MTT-S member, an ACES member, a Sigma Xi Member, and a member of Chinese Computational Electromagnetics Society. He was the Semiconductor Research Cooperation (SRC) Industrial Liaison for several academic projects. In 2009, he was the SRC Packaging TT Chair. He was the TPC member of IEEE EDAPS since 2010, the TPC member of 2013 IEEE ICMTCE, the scientific committee member of 2010 IEEE SMEE, the special session organizers of IEEE EDAPS, ACES, AP-RASC, co-organizer of HKU Computational Science and Engineering Workshops in 2010-2012, the TC-9 and TC-10 member of IEEE EMC-S since 2011, the TPC Chair of the 7th International Conference on Nanophotonics (ICNP)/the 3rd Conference on Advances in Optoelectronics and Micro/Nano Optics (AOM), and session chairs of many international conferences. He also serves as the reviewer of IEEE Transactions on several topics, and other primary electromagnetics and microwave related journals. His research interests focus on electromagnetics, computational electromagnetics, IC signal/power integrity, IC EMC/EMI, antennas, multidisciplinary EDA solutions, RF and microwave technologies, high performance computing (HPC), etc.

Personal CV